Publications of Rainer Leupers

Publications from Jul/ 2024 to 2023

• Happek, L., Huang, J.-T., Garcia Gener, A., Leupers, R. and Galicia, M.: Spiking Neural Networks for Signal Classification with Digital and Analog Neuromorphic Systems: A Comparative Study, in The International Joint Conference on Neural Networks (IJCNN) , Jul. 2024, accepted for publication ©2024 IEEE
  
• Bosbach, N., Zurstraßen, N., Pelke, R., Jünger, L., Weinstock, J. H. and Leupers, R.: Towards High-Performance Virtual Platforms: A Parallelization Strategy for SystemC TLM-2.0 CPU Models, in Design Automation Conference , Jun. 2024, accepted for publication, 10.1145/3649329.3658257
  
• Reimann, L. M., Prashar, A., Ghinami, C., Pelke, R., Šišejković, D., Merchant, F. and Leupers, R.: QTFlow: Quantitative Timing-Sensitive Information Flow for Security-Aware Hardware Design on RTL, in Proceedings of the International Symposium on VLSI Design, Automation & Test (VLSI-DAT), Apr. 2024, accepted for publication
  
• Bosbach, N., Salama, A., Jünger, L., Burton, M., Zurstraßen, N., Pelke, R. and Leupers, R.: NQC²: A Non-Intrusive QEMU Code Coverage Plugin, in Rapid Simulation and Performance Evaluation for Design (RAPIDO '24), January 18, 2024, Munich, Germany ( New York, NY, USA), Association for Computing Machinery, Jan. 2024, ISBN: 979-8-40071-791-8, 10.1145/3642921.3642924
  
• Zurstraßen, N., Brandhofer, R., Cubero-Cascante, J., Bosbach, N., Jünger, L. and Leupers, R.: The Optimal Quantum of Temporal Decoupling, in 29th Asia and South Pacific Design Automation Conference, 2024, 10.1109/ASP-DAC58780.2024.10473967 ©2024 IEEE
  
• Pelke, R., Cubero-Cascante, J., Bosbach, N., Staudigl, F., Leupers, R. and Joseph, J. M.: CLSA-CIM: A Cross-Layer Scheduling Approach for Computing-in-Memory Architectures, in Proceedings of the Conference on Design, Automation & Test in Europe (DATE), 2024, accepted for publication, 10.48550/arXiv.2401.07671 ©2024 IEEE
  
• Cubero-Cascante, J., Vaidyanathan, A., Pelke, R., Pfeifer, L., Leupers, R. and Joseph, J. M.: A Calibratable Model for Fast Energy Estimation of MVM Operations on RRAM Crossbars, in 2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS), pp. 537-541, 2024, accepted for publication
  
• Reimann, L. M., Wiesner, J., Šišejković, D., Merchant, F. and Leupers, R.: SoftFlow: Automated HW-SW Confidentiality Verification for Embedded Processors, in 31st IFIP/IEEE Conference on Very Large Scale Integration (VLSI-SoC 2023), Oct. 2023, 10.1109/VLSI-SoC57769.2023.10321922 ©2023 IEEE
  
• Pelke, R., Bosbach, N., Cubero-Cascante, J., Staudigl, F., Leupers, R. and Joseph, J. M.: Mapping of CNNs on multi-core RRAM-based CIM architectures, in 2023 IFIP/IEEE 31th International Conference on Very Large Scale Integration (VLSI-SoC) , Oct. 2023, 10.48550/arXiv.2309.03805 ©2023 IEEE
  
• Bosbach, N., Pelke, R., Zurstraßen, N., Jünger, L., Weinstock, J. H. and Leupers, R.: Work-in-Progress: A Generic Non-Intrusive Parallelization Approach for SystemC TLM-2.0-based Virtual Platforms, in International Conference on Hardware/Software Codesign and System Synthesis , Sep. 2023, 10.1145/3607888.3608596
  
• Galicia, M., Osman, I., Owusu-Afriyie, C. and Leupers, R.: "S3cure": Scramble, Shuffle and Shambles - Secure Deployment of Weight Matrices in Memristor Crossbar Arrays, in Association for Computing Machinery, ACM, ICONS '23: Proceedings of the 2023 International Conference on Neuromorphic Systems, Aug. 2023, 10.1145/3589737.3605964
  
• Reimann, L. M., Staudigl, F. and Leupers, R.: Automated Information Flow Analysis for Integrated Computing-in-Memory Modules, in IEEE NEWCAS, Jun. 2023, 10.1109/NEWCAS57931.2023.10198075 ©2023 IEEE
  
• Moussavi, E., Singh, A., Šišejković, D., Kumar, A., Kizatov, D., Ingebrandt, S., Leupers, R., Pachauri, V. and Merchant, F.: Gate Camouflaging Using Reconfigurable ISFET-Based Threshold Voltage Defined Logic, in arXiv preprint arXiv:2304.05686, The 21st IEEE Interregional NEWCAS Conference (NEWCAS 2023) , Jun. 2023, accepted for publication, 10.48550/arXiv.2304.05686 ©2023 IEEE
  
• Galicia, M., Happek, L., Balzer, M. and Leupers, R.: Frequency and noise characterization for baseband signal processing on neuromorphic circuits, in 21st IEEE Interregional NEWCAS Conference (NEWCAS), Jun. 2023, 10.1109/NEWCAS57931.2023.10198095 ©2023 IEEE
  
• Bosbach, N., Jünger, L., Pelke, R., Zurstraßen, N. and Leupers, R.: Entropy-Based Analysis of Benchmarks for Instruction Set Simulators, in RAPIDO2023: Proceedings of the DroneSE and RAPIDO: System Engineering for constrained embedded systems (New York, NY, USA), pp. 54-59, Association for Computing Machinery, Jan. 2023, ISBN: 979-8-40070-045-3, 10.1145/3579170.3579267
  
• Sharma, N. N., Jain , R., Pokkuluri, M. M., Patkar, S., Leupers, R., Nikhil, R. S. and Merchant, F.: CLARINET: A Quire-Enabled RISC-V-Based Framework for Posit Arithmetic Empiricism, in Journal of Systems Architecture (Elsevier), 2023, accepted for publication
  
• Thieu, G. B., Gesper, S., Paya Vaya, G., Riggers, C., Renke, O., Fiedler, T., Marten, J., Stuckenberg, T., Blume, H., Weis, C., Steiner, L., Sudarshan, C., Wehn, N., Reimann, L. M., Leupers, R., Beyer, M., Köhler, D., Jauch, A., Bormann, J. M., Jaberansari, S., Berthold, T., Blawat, M., Kock, M., Schewior, G., Benndorf, J., Kautz, F., Bluethgen, H.-M. and Sauer, C.: ZuSE-KI-AVF: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving, in Proceedings of the Conference on Design, Automation & Test in Europe (DATE), 2023
  
• Šišejković, D. and Leupers, R.: Logic Locking - A Practical Approach to Secure Hardware, Springer Cham, 1 ed., 2023, ISBN: 978-3-03119-122-0, 10.1007/978-3-031-19123-7
  
• Zurstraßen, N., Cubero-Cascante, J., Joseph, J. M., Yichao, L., Xinghua, X. and Leupers, R.: par-gem5: Parallelizing gem5 s Atomic Mode, in 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1-6, 2023, 10.23919/DATE56975.2023.10137178
  
• Zurstraßen, N., Bosbach, N., Joseph, J. M., Jünger, L., Weinstock, J. H. and Leupers, R.: Efficient RISC-V-on-x64 Floating Point Simulation, in ICCD, 2023, 10.1109/ICCD58817.2023.00090 ©2023 IEEE
  

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