Latest Publications
Chen, X., Liu, M., Gui, G., Abedisi, B., Gacanin, H. and Sari, H.:
Complex Deep Neural Network Based Intelligent Signal Detection Methods for OFDM-IM Systems,
in
The 2021 Joint EuCNC & 6G Summit, 8-11 June 2021, Porto, Portugal.,
Jun. 2021, accepted for publication
Saxena, V., Reddy, A., Jonathan, N., Gustafson, J. L., Sangeeth, N., Leupers, R. and Merchant, F.:
Brightening the Optical Flow through Posit Arithmetic,
in
International Symposium on Quality Electronic Design (ISQED),
Apr. 2021, accepted for publication ©2021 IEEE
Yin, Y., Liu, M., Gacanin, H., Sari, H. and Adachi, F.:
Cross-Layer Resource Allocation for UAV-Assisted Wireless Caching Networks with NOMA,
in IEEE Transactions on Vehicular Technology,
IEEE,
Mar. 2021, accepted for publication ©2021 IEEE
The Institute for Communication Technologies and Embedded Systems (ICE) is jointly directed by Prof. Rainer Leupers (Chair for Software for Systems on Silicon, SSS) and Prof. Haris Gačanin (Chair for Distributed Signal Processing, DSP), who collaborate closely in research and complement each other with their expertise.
Key research areas at ICE:
- Wireless signal processing and networking for wireless communication systems: from algorithm to implementation
- Intelligent systems and short-range communication systems (e.g. AI-based RRM, D2D, Cyber Physical Systems, M2M, Wireless 2.0)
- Design of sensors with convergence of signal processing and machine learning methodologies
- Efficient hardware accelerators and processor architectures for embedded applications, in particular multiprocessor systems-on-chip (MPSoC)
- Electronic system-level (ESL) design tools for application-specific HW/SW systems
- Software development tools (e.g. compilers and fast simulators) for heterogeneous multicore architectures
- Hardware security
Contact
Institute for Communication Technologies and Embedded Systems
Chair for Software for Systems on Silicon | Chair for Distributed Signal Processing |
Kopernikusstraße 16
52074 Aachen
Germany
sekretariat(at)ice.rwth-aachen.de
Bridging the Frequency Gap in Heterogeneous 3D SoCs with Technology-Specific NoCs
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators