Institute for Communication Technologies and Embedded Systems

Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators

Authors:
Joseph, J. M. ,  Samajdar, A. ,  Zhu, L. ,  Leupers, R. ,  Lim, S.-K. ,  Pionteck, T. ,  Krishna, T.
Video:
Book Title:
International Symposium on Quality Electronic Design (ISQED)
Date:
2021
DOI:
10.1109/ISQED51717.2021.9424349
hsb:
RWTH-2021-07903
Language:
English
Abstract:
The everlasting demand for higher computing power
for deep neural networks (DNNs) drives the development of
parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase performance because it introduces another level of spatial parallelism. Therefore, we analyze dataflows, performance, area, power and temperature of such 3D-DNN-accelerators. Monolithic and TSV-based stacked 3D-ICs are compared against 2D-ICs. We identify workload properties and architectural parameters for efficient 3D-ICs and achieve up to 9.14x speedup of 3D vs. 2D. We discuss area-performance trade-offs. We demonstrate applicability as the 3D-IC draws similar power as 2D-ICs and is not thermal limited.
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