Institute for Communication Technologies and Embedded Systems

A Modular Simulation Framework for Architectural Exploration of On-Chip Interconnection Networks

Authors:
Kogel, T. ,  Dörper, M. ,  Wieferink, A. ,  Leupers, R.Ascheid, G.Meyr, H. ,  Goossens, S.
Book Title:
The First IEEE/ACM/IFIP International Conference on HW/SW Codesign and System Synthesis
Address:
Newport Beach (California USA)
Date:
Oct. 2003
Language:
English
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