Institute for Communication Technologies and Embedded Systems

Modelling modern processors using FEM and compact model — A comparative study

Authors:
Galicia, M. ,  Zajac, P. ,  Maj, C. ,  Szermer, M. ,  Napieralski, A.
Booktitle:
2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)
Page(s):
293-297
Date:
2014
DOI:
10.1109/MIXDES.2014.6872204
Language:
English
Abstract:
A variety of thermal models has been proposed to predict the temperatures inside modern processors. In this paper, we describe and compare two such approaches, a detailed FEM-based simulation and a simpler architectural compact model. It is shown that both models provide comparable results when it comes to predicting the maximal temperature, however there are also non-negligible differences when estimating thermal gradients within a chip.
Download:
BibTeX