Andreas Bytyn


Andreas Bytyn received the B.Sc. and M.Sc. degree from RWTH Aachen University in 2011 and 2014 respectively. Since April 2014 he has been working at the Institute for Communication Technologies and Embedded Systems (ICE) as research assistant pursuing his PhD degree. During his time he was involved in different projects funded both by industry and public ministries. Topics covered during his work range from Software Defined Radio (SDR) for Industry 4.0 applications, efficient hardware architectures for ultra-fast wireless indoor communication in the mmWave-spectrum (LP100) as well as the design of application-specific accelerators for Deep Learning applications in the context of highly automated cars (PARIS).

Research Interests

  • Digital integrated circuits / VLSI design
  • Deep Learning and Machine Learning
  • Application-Specific Instruction-Set Processors (ASIPs)
  • Computer Architecture


Laux, H., Bytyn, A., Ascheid, G., Schmeink, A., Karabulut Kurt, G. and Dartmann, G.: Learning-Based Indoor Localization for Industrial Applications, in Workshop on Sensor Data Fusion and Machine Learning for next Generation of Cyber-Physical-Systems in conjunction with ACM International Conference on Computing Frontiers 2018, pp. 355-362 , ACM New York, NY, May. 2018, 10.1145/3203217.3203227

Bytyn, A. (Ed.), Springer, J. (Ed.), Leupers, R. (Ed.) and Ascheid, G. (Ed.): VLSI implementation of LS-SVM training and classification using entropy based subset-selection, 2017 IEEE International Symposium on Circuits and Systems (ISCAS), May. 2017, 10.1109/ISCAS.2017.8050590 ©2017 IEEE

Wang, G., Bytyn, A., Khajavi , D., Wang, Y., Negra, R. and Ascheid, G.: Power Efficiency of Millimeter Wave Transmission Systems with Large Number of Antennas, in Proceedings of IEEE Vehicular Technology Conference (VTC-Fall), pp. 1-6, Sep. 2016 ©2016 IEEE

Guenther, D., Bytyn, A., Leupers, R. and Ascheid, G.: Energy-efficiency of floating-point and fixed-point SIMD cores for MIMO processing systems, in Proceedings of the International Symposium on System-on-Chip (SoC)(Tampere), pp. 1-7, IEEE, Oct. 2014, 10.1109/ISSOC.2014.6972429 ©2014 IEEE